NSN 5961-01-133-4566 (5961011334566) Listing

Alternative NSN: 5961-01-133-4566
Item Name: Semiconductor Device Diode
FSG: 59 Electrical and Electronic Equipment Components
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware
NIIN: 011334566
NCB Code: USA (01)
Manufacturers: Avago Technologies U S Inc, Cobham Electronic Systems Inc, Hewlett Packard Company, Micro Uspd Inc, Microsemi Corp, Rockwell Collins Inc

Browse NSN parts of NSN 5961-01-133-4566 and get lowest price for your requested parts in 15 minutes. Just ordered part of NSN 5961-01-133-4566 like 922-6508-012, GC40605, MA47230, QPND-4912, QPND-4912 described as Semiconductor Device Diode from industry leading manufactures such as Rockwell Collins Inc, Microsemi Corp, Cobham Electronic Systems Inc, Hewlett Packard Company, Avago Technologies U S Inc. We are proud to offer an inventory of over 2 billion ready-to-ship parts, 24/7 availability, and key locations in the U.S./abroad. These attributes allow us to meet all aircraft on ground (AOG) requirements with ease.

Part Number's List for NSN 5961-01-133-4566, 5961011334566

Part No Manufacturer Item Name QTY RFQ
922-6508-012 Rockwell Collins Inc semiconductor device diode Avl RFQ
GC40605 Microsemi Corp semiconductor device diode Avl RFQ
MA47230 Cobham Electronic Systems Inc semiconductor device diode Avl RFQ
QPND-4912 Hewlett Packard Company semiconductor device diode Avl RFQ
QPND-4912 Avago Technologies U S Inc semiconductor device diode Avl RFQ
U9510 Micro Uspd Inc semiconductor device diode Avl RFQ

Product Specification of NSN 5961011334566

MRCCriteriaCharacteristic
ABBHINCLOSURE MATERIALGLASS
ABHPOVERALL LENGTH0.170 INCHES MAXIMUM
ABJTTERMINAL LENGTH1.000 INCHES MINIMUM
ADAVOVERALL DIAMETER0.076 INCHES MAXIMUM
AGAVEND ITEM IDENTIFICATIONDATA LINK;AIRCRAFT, C-2A (REPROCURED); HELICOPTER, H-53E; EMORY S. LAND CLASS AS; HELICOPTER, ADVANCE ATTACK, AH-1W; 2M/ATE MICROMINIAUTURE AUTOMATIC TEST EQUIPMENT; TARAWA CLASS LHA; LANDING CRAFT AIR CUSHION (LCAC); HELICOPTER, SEARCH AND
AXGYMOUNTING METHODTERMINAL
CBBLFEATURES PROVIDEDHERMETICALLY SEALED CASE
CTMZSEMICONDUCTOR MATERIALSILICON
CTQNVOLTAGE RATING IN VOLTS PER CHARACTERISTIC100.0 MAXIMUM REVERSE VOLTAGE, PEAK
CTRDPOWER RATING PER CHARACTERISTIC250.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE
CTSGMAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 DEG CELSIUS JUNCTION
FEATSPECIAL FEATURESHARDNESS CRITICAL PROCESS
NHCFNUCLEAR HARDNESS CRITICAL FEATUREHARDENED
TTQYTERMINAL TYPE AND QUANTITY2 PIN

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