NSN 5962-01-099-6383 (5962010996383) Listing

Alternative NSN: 5962-01-099-6383

FSG: 59 Electrical and Electronic Equipment Components

Federal Supply Class (FSC): 5962 Microcircuits Electronic

NCB Code: USA (01)

Manufacturers: Intersil Corporation, L 3 Communications Corporation, Mmi Amd, National Semiconductor Corp, Philips Semiconductors Inc

Browse NSN parts of NSN 5962-01-099-6383 and get lowest price for your requested parts in 15 minutes. Just ordered part of NSN 5962-01-099-6383 like 21008-05, 21008-05, 21008-05, 21008-05, 21008-05 described as Microcircuit Memory from industry leading manufactures such as Mmi Amd, L 3 Communications Corporation, Intersil Corporation, National Semiconductor Corp, Philips Semiconductors Inc. We are proud to offer an inventory of over 2 billion ready-to-ship parts, 24/7 availability, and key locations in the U.S./abroad. These attributes allow us to meet all aircraft on ground (AOG) requirements with ease.

Part Number's List for NSN 5962-01-099-6383, 5962010996383

Part No	Manufacturer	Item Name	QTY	RFQ
21008-05	Mmi Amd	microcircuit memory	Avl	RFQ
21008-05	L 3 Communications Corporation	microcircuit memory	Avl	RFQ
21008-05	Intersil Corporation	microcircuit memory	Avl	RFQ
21008-05	National Semiconductor Corp	microcircuit memory	Avl	RFQ
21008-05	Philips Semiconductors Inc	microcircuit memory	Avl	RFQ
DM54S573J 883B	National Semiconductor Corp	microcircuit memory	Avl	RFQ
HM1-7643-8	Intersil Corporation	microcircuit memory	Avl	RFQ
MM5353-1D 883B	Mmi Amd	microcircuit memory	Avl	RFQ
MM5353D 883B	Mmi Amd	microcircuit memory	Avl	RFQ
S82S137F 883B	Philips Semiconductors Inc	microcircuit memory	Avl	RFQ
S82S137I 883B	Philips Semiconductors Inc	microcircuit memory	Avl	RFQ

Product Specification of NSN 5962010996383

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM
ADAT	BODY WIDTH	0.310 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND W/OPEN COLLECTOR AND 3-STATE OUTPUT
CQSJ	INCLOSURE MATERIAL	CERAMIC AND GLASS
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
CQZP	INPUT CIRCUIT PATTERN	12 INPUT
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
CZEQ	TIME RATING PER CHACTERISTIC	40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CZER	MEMORY DEVICE TYPE	ROM
TEST	TEST DATA DOCUMENT	11627-21008 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN
TTQY	TERMINAL TYPE AND QUANTITY	18 PRINTED CIRCUIT

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