| Alternative NSN: 5962-01-274-7927 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012747927 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime, Hamilton Sundstrand Corporation, Honeywell International Inc, Paaesikunta Logistiikkaosasto, Xicor Ltd |
Browse NSN parts of NSN 5962-01-274-7927 and get lowest price for your requested parts in 15 minutes. Just ordered part of NSN 5962-01-274-7927 like 10133817, 5962-8771201YA, 5R8067-042-3002, 795099-1, 8507005-255 described as Microcircuit Memory from industry leading manufactures such as Paaesikunta Logistiikkaosasto, Dla Land And Maritime, Hamilton Sundstrand Corporation, Honeywell International Inc, Xicor Ltd. We are proud to offer an inventory of over 2 billion ready-to-ship parts, 24/7 availability, and key locations in the U.S./abroad. These attributes allow us to meet all aircraft on ground (AOG) requirements with ease.
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 10133817 | Paaesikunta Logistiikkaosasto | microcircuit memory | Avl | RFQ |
| 5962-8771201YA | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
| 5R8067-042-3002 | Hamilton Sundstrand Corporation | microcircuit memory | Avl | RFQ |
| 795099-1 | Hamilton Sundstrand Corporation | microcircuit memory | Avl | RFQ |
| 8507005-255 | Honeywell International Inc | microcircuit memory | Avl | RFQ |
| X2004EM 25 C6317 | Xicor Ltd | microcircuit memory | Avl | RFQ |
| X2004EMB-25 | Xicor Ltd | microcircuit memory | Avl | RFQ |
| X20C04EMB-25 | Xicor Ltd | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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5905-00-001-2971 (5905000012971) |
5905-00-001-3031 (5905000013031) |
5905-00-001-3050 (5905000013050) |
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5905-00-001-3085 (5905000013085) |
5905-00-001-3197 (5905000013197) |
5905-00-001-3806 (5905000013806) |
|
5905-00-001-3819 (5905000013819) |
5905-00-001-3821 (5905000013821) |
5905-00-001-3822 (5905000013822) |
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5905-00-001-3824 (5905000013824) |
5905-00-001-3825 (5905000013825) |
5905-00-001-3827 (5905000013827) |
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