| Part Number: 709CH001 | Manufacturer: Telcom Semiconductor Inc |
| NSN : 5962-00-901-3890 (5962009013890) | Item Name : microcircuit linear |
| CAGE Code: 15818 | FSC : 5962 Microcircuits Electronic |
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-901-3890 Item Description: Microcircuit Linear | 5962 | 009013890 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | G | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 709ch001 | 3 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.060 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 250.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | INTERNALLY COMPENSATED AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 5 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, DIFFERENTIAL |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 10.0 VOLTS MAXIMUM POWER SOURCE |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 05869-710398 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 10 FLAT LEADS |
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